Dresden 2009 – wissenschaftliches Programm

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DS: Fachverband Dünne Schichten

DS 11: Layer Growth: Evolution of Structure and Simulation

DS 11.4: Vortrag

Dienstag, 24. März 2009, 14:45–15:00, GER 37

Basics of the atomic layer deposition of HfO2 onto Si/SiO2 substrates: in-situ investigations with XPS, XAS and UHV-AFM — •Massimo Tallarida, Konstantin Karavaev, Krzysztof Kolanek, and Dieter Schmeisser — Brandenburgische Technische Universität, LS Angewandte Physik-Sensorik, Konrad-Wachsmann-Allee, 17, 03046, Cottbus, Germany

We developed a reactor for investigating in-situ the atomic layer deposition (ALD) of HfO2. X-ray photoelectron and X-ray absorption spectra were collected after each ALD cycle using synchrotron radiation at the beamline U49-2/PGM2 - BESSY II, Berlin. The morphology of the substrate and thin film surfaces was investigated after each ALD cycle with an UHV-AFM microscopy attached to the ALD reactor. We studied the ALD on differently prepared substrates, at different substrate temperatures, and using different Hf-precursors (HfCl4, TEMAHf, TDMAHf). We observed the evolution of the Si/SiO2/HfO2 system during the formation of the first three Hf-oxide layers [1]; we detected the incorporation of Cl into the Hf-oxide films and proposed a mechanism responsible for the Cl contamination [2]; we found evidence of the interfacial-SiO2 growth during the initial ALD cycles and of dipole formation at the HfO2/SiO2 interface. In this contribution we illustrate the basics of the technique used, and discuss the physical-chemical properties of ALD on the basis of the experimental results.
[1] M. Tallarida, K. Karavaev, and D. Schmeisser, J. Appl. Phys. 104, 064116 (2008); [2] M. Tallarida, K. Karavaev, and D. Schmeisser, J. Vac. Sci. Technol. B, accepted for publication.

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