Regensburg 2010 – wissenschaftliches Programm

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DS: Fachverband Dünne Schichten

DS 9: Poster: Synthesis of Nanostructured Films by Self-organization, Thermoelectric Thin Films and Nanostructures, High-k and Low-k Dielectrics, Layer Deposition Processes, Layer Growth, Layer Properties, Application of Thin Films, Surface Modification, Hard and Superhard Coatings, Metal Layers

DS 9.11: Poster

Montag, 22. März 2010, 15:00–17:30, Poster D1

Smoothening and patterning of Si surfaces produced by metal surfactant sputtering — •Kun Zhang and Hans Hofsäss — II. Physikalisches Institut, Universität Göttingen, Friedrich-Hund-Platz 1, 37077 Göttingen

Surfactant sputtering provides a novel, versatile sputter technique utilizing the steady state coverage of a substrate surface with up to 10¹⁶ /cm² of foreign or self atoms simultaneously during sputter erosion by combined ion irradiation and atom deposition. Depending on the chemical relation of the materials between the substrate and the surfactant, nanocluster, nano-meter thin film or nano-compound can form on the substrate surface or be burred in the top layers of substrate, which strongly modify the substrate sputter yield on atomic to macroscopic length scales, and further more, produce different surface morphologies (smoothening or nano-pattern from dots to ripple). In this study, metal surfactants (such as Au, Ag, Pt, Ni, Fe and steel etc.) were used to produce ultra-smooth surface or different surface nano-pattern on silicon, specially at the incident angle near substrate normal direction, at which no nano-pattern would form in the absence of deposition of surfactant atoms, predicted by the Bradley-Harper theory and demonstrated by many experiments. Si(100) substrates were eroded using 5 keV Xe-ions at the fluence of up to 10¹⁸ /cm² under continuous deposition of metal atoms from surfactant targets, which were sputtered simultaneously by the same ion-beam. The surface topography, the composition, and the microstructure of the nanocomposites have been analyzed via RBS, AFM and TEM.