Regensburg 2010 – wissenschaftliches Programm
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O: Fachverband Oberflächenphysik
O 41: Poster Session I (Semiconductor Substrates: Epitaxy and growth; Semiconductor Substrates: Adsorbtion; Semiconductor Substrates: Solid-liquid interfaces; Semiconductor Substrates: Clean surfaces; Oxides and insulators: Epitaxy and growth; Oxides and insulators: Adsorption; Oxides and insulators: Clean surfaces; Organic, polymeric and biomolecular films - also with adsorbates; Organic electronics and photovoltaics, Surface chemical reactions; Heterogeneous catalysis; Phase transitions; Particles and clusters; Surface dynamics; Surface or interface magnetism; Electron and spin dynamics; Spin-Orbit Interaction at Surfaces; Electronic structure; Nanotribology; Solid/liquid interfaces; Graphene; Others)
O 41.96: Poster
Dienstag, 23. März 2010, 18:30–21:00, Poster B1
Tribological self-repair mechanisms investigated under medium load conditions — •Mathias Biester1, Xinlei Gao2, Jian Li3, Syed Imad-Uddin Ahmed1, and Matthias Scherge1 — 1Institut für Physik und Institut für Mikro- und Nanotechnologien, TU Ilmenau, P.O. Box 100565, 98684 Ilmenau, Germany — 2Department of Chemical and Environmental Engineering, Wuhan Polytechnic University, Wuhan, P.O. Box 430023, P. R. China — 3Wuhan Research Institute of Materials Protection, Wuhan, P.O. Box 430030, P.R. China
Wear is the main effect for the limited life-time of most mechanical systems and causes very cost-intensive repair and replacement activities. Therefore, a lot of efforts are made to reduce wear and to increase the life-time of modern mechanical systems. Cu (II) chelate of bissalicylaldehyde-ethylenediamine was chosen as additive for liquid lubricants, which is investigated as it has a big self-repair potential. This Schiff base copper complex is a metal-organic chelate complex, which is able to create negative wear as well as to reduce friction due to the self-assembling of a protective layer. Under high temperatures and high contact pressures, which occur during the friction processes, the copper is released from the complex and attaches at the surface. This process is investigated using a micro-tribometer in the milli Newton range to create applicational friction conditions. Additional characterisations are performed with AFM, SEM and spectroscopic methods to analyse the self-repair effects and display tendencies for future applications.