Mainz 2014 – wissenschaftliches Programm

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T: Fachverband Teilchenphysik

T 115: Halbleiter 7

T 115.6: Vortrag

Donnerstag, 27. März 2014, 18:00–18:15, P109a

Bump-bonding for the Phase 1 Upgrade of the CMS pixel detectorThomas Blank2, Michele Caselle2, •Fabio Colombo1, Ulrich Husemann1, Simon Kudella1, Benjamin Leyrer2, and Marc Weber21Institut für Experimentelle Kernphysik (IEKP), KIT — 2Institut für Prozessdatenverarbeitung und Elektronik (IPE), KIT

As part of the CMS Phase 1 Upgrade program, a replacement of the whole pixel detector is foreseen during the 2016/2017 technical stop of the LHC. The future four-layer pixel detector, based on an hybrid sensor-readout chip technique already employed for the current detector, is explicitly designed to cope with the expected increase in luminosity of the LHC, which is intended to exceed the nominal value by a factor of two in the next few years. The new pixel system will bring a number of improvements compared to the current detector as, for example, a new design of the readout chip and an overall reduction of the material budget. Four German institutes are responsible for building the pixel modules that will be arranged in the fourth barrel layer of the new system and half of them will be assembled at the Karlsruhe Institute of Technology (KIT). In this talk, a general overview of the bonding technique between Silicon sensors and readout chips, based on SnPb bumps, will be given. Common problems associated with the bonding, their solutions and a summary of the methods designed to test the quality of the process will also be discussed.

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