Mainz 2014 – scientific programme

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T: Fachverband Teilchenphysik

T 88: Halbleiter 5

T 88.3: Talk

Wednesday, March 26, 2014, 17:15–17:30, P109a

Micro-channel cooling for silicon detectors — •Nils Flaschel, Kerstin Tackmann, Ingrid-Maria Gregor, and Andreas Mussgiller — DESY, Hamburg, Deutschland

The ATLAS detector at the LHC has been taking data since November 2009. Its inner part consists of silicon pixel and strip sensors. In LHC experiments, the silicon detectors, which are positioned very close to the interaction point, receive considerable radiation doses. The sensors need to be kept at low temperatures to keep the leakage current small, avoid thermal run-away and to avoid uncontrolled annealing. The cooling system typically adds a significant amount of material and hence radiation lengths to the detector. During the upgrade for the HL-LHC the number of silicon detector layers will be increased, which will add extra material. Microchannel cooling is considered to be a promising technology to reduce material and space per layer in current and future HEP detectors. As the channels are etched directly into silicon, the cooling system can be brought into direct thermal contact with the sensor. A first silicon wafer with microchannels has been developed and simulated using OpenFOAM and was produced by CNM in Barcelona. A test stand has been prepared to characterize both the thermal and mechanic properties of the channels.