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T: Fachverband Teilchenphysik
T 90: Halbleiter 6
T 90.3: Talk
Wednesday, March 26, 2014, 17:20–17:35, P108
Test of Electrical Multi-Chip Module for Belle II Pixel Detector — •Felix Müller1, Ladislav Andricek2, Paola Avella1, Christian Kiesling1, Christian Koffmane2, Hans-Günther Moser1, Jelena Ninkovic2, Florian Schopper2, Rainer Richter2, Manfed Valentan1, and Andreas Wassatsch2 for the Belle II collaboration — 1Planck-Institut für Physik, München — 2Halbleiterlabor der Max-Planck-Gesellschaft, München
DEPFET pixel detectors offer excellent signal to noise ratio, resolution and low power consumption with few material. They will be used at Belle II and are a candidate for an ILC vertex detector. The Electrical Multi-Chip Module (EMCM) has been designed to study the back end of line (BEOL) and the metal layer interconnectivity of the DEPFET matrix production for Belle II. The electrical characterization of the EMCM allows studying the signal and control line routings. Having verified the integrity of the electrical network three different ASIC types can be assembled. The electrical characterization of the assembled module allows the analysis and optimization of the ASICs in terms of data integrity. The EMCM serves also as a mechanical test structure to exercise flip-chip and wire bonding. Finally a small DEPFET prototype matrix can be mounted on the module which acts as silicon PCB. Consequently, the full study of the complete readout chain can be done.
An overview of the EMCM concept and first characterization results will be presented.