Regensburg 2016 – wissenschaftliches Programm
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TT: Fachverband Tiefe Temperaturen
TT 58: Transport: Poster Session
TT 58.18: Poster
Mittwoch, 9. März 2016, 15:00–18:30, Poster D
Circuit QED with 3D cavities — •Edwar Xie1,2,3, Peter Eder1,2,3, Michael Fischer1,2,3, Jan Goetz1,2,3, Max Haeberlein1,2, Karl Friedrich Wulschner1,2, Frank Deppe1,2,3, Kirill Fedorov1, Achim Marx1, and Rudolf Gross1,2,3 — 1Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching, Germany — 2Physik-Department, TU München, 85748 Garching, Germany — 3Nanosystems Initiative Munich (NIM), 80799 München, Germany
In typical circuit QED systems, on-chip superconducting qubits are coupled to integrated coplanar microwave resonators. Due to the planar geometry, the resonators are often a limiting factor regarding the total coherence of the system. Alternatively, similar hybrid systems can be realized using 3D microwave cavities.
Here, we present studies on transmon qubits capacitively coupled to 3D cavities. The internal quality factors of our 3D cavities, machined out of high purity aluminum, are above 1.4 ·106 at the single photon level and a temperature of 50 mK. For characterization of the sample, we perform dispersive shift measurements up to the third energy level of the qubit. We show simulations and data describing the effect of the transmon geometry on it’s capacitive properties. In addition, we present progress towards an integrated quantum memory application.
We acknowledge support by the German Research Foundation through SFB 631 and FE 1564/1-1, the EU project PROMISCE, and Elite Network of Bavaria through the program ExQM.