Dresden 2020 – wissenschaftliches Programm
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TT 16.40: Poster
Montag, 16. März 2020, 15:00–19:00, P2/EG
Dielectric Low Temperature Properties of Printed Circuit Boards made of FR4 — •Andreas Rall, Benedikt Frey, Andreas Schaller, Andreas Fleischmann, Andreas Reiser, and Christian Enss — Kirchhoff-Institute for Physics, Heidelberg University, D-69120 Heidelberg
Printed circuit boards (PCB) are commonly used in electronic devices and are increasingly utilized in various low temperature applications. In many cases standard FR4 is used, which is a laminate of glassfibers (alumino-borosilicate glass) and brominated epoxy resin. Little is known about its low temperature properties. We present dielectric measurements of FR4 down to a few millikelvin temperatures, where we use the material as dielectric sample of a plate capacitor in a superconducting LC-resonator at MHz frequencies.
The observed behavior can be well understood in terms of atomic two-level tunneling systems, that are known to dominate the low temperature properties of amorphous solids. The material shows a good thermalisation with the cryogenic environment even at the lowest measured temperatures. Measurements of the sample's temperature with a thermometer directly mounted on the sample can confirm this good thermalisation.