Regensburg 2013 – wissenschaftliches Programm

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MM: Fachverband Metall- und Materialphysik

MM 15: Poster Session

MM 15.69: Poster

Montag, 11. März 2013, 18:00–20:00, Poster E

A molecular dynamics study of crack/void interaction in α-Iron — •Tianxiang Liu, Sebastien Groh, and Abdolhamid Attaran — Institute for Mechanics and Fluid Dynamics, TU Bergakademie Freiberg, Lampadiusstr. 4, 09596 Freiberg, Germany

When a crack front interacts with an array of a second-phase inclusions, it bends to an angle before it moves furthers. Depending on the strength of the inclusions, the crack front either remains relatively straight or bows between inclusions and moves deeply along the easy path. The resistance to crack growth is therefore changed by the presence of inclusions.

In this paper, we are presenting a study on crack/void interaction using molecular dynamics. α-iron modeled with an EAM potential was considered. Three distributions of void were considered: (i) void positioned at varying distance normal to the crack tip, (ii) void inserted at varying distances along the crack-tip and (iii) void placed in such a way that dislocations nucleated at the crack tip reached the void when moving. The data obtained for the different configurations were compared to the ones obtained in a void free specimen.

Depending on the configuration, elastic shielding or anti-shielding was observed as a function of the temperature and strain rate. The increase in temperature would augment the shielding effect in all the configurations. The anti-shielding effect was detected in the first configuration. This effect diminished as the void was moved away from the crack tip as expected by elasticity.

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DPG-Physik > DPG-Verhandlungen > 2013 > Regensburg