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CPP: Fachverband Chemische Physik und Polymerphysik
CPP 50: Poster Session III
CPP 50.34: Poster
Dienstag, 17. März 2020, 14:00–16:00, P1C
Stress components in adhesive joints of micromechanical structures — •Rika Unkelbach1,2, Jan Kuypers1, and Christine Papadakis2 — 1Blickfeld GmbH, 80339 München, Germany — 2TU München, Physik-Department, Physik weicher Materie, 85748 Garching, Germany
The use of adhesives as a joining technique in structural applications is widespread and on the rise. For simple geometries such as lap shear joints, stress components can be analytically predicted and are well understood. However, the stress distribution for unusual joints or loading conditions is more complex and requires a more detailed analysis.
We present an approach to identify the stress components that eventually will lead to a failure of the joint in a specific micromechanical structure under torsional loading that has motivated this research. The influence of peeling and shear stress components in regards to the joint stability is discussed based on experimental data and results obtained from finite element analysis (FEA).