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Dresden 2020 – wissenschaftliches Programm

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HL: Fachverband Halbleiterphysik

HL 10: Focus: High-resolution Lithography and 3D Patterning (Part I) (joint session KFM/CPP/HL)

Montag, 16. März 2020, 09:30–12:50, TOE 317

Chair: Robert Kirchner (TU Dresden)

09:30 HL 10.1 Hauptvortrag: Novel device integration - combining bottom-up and top-down approaches — •Artur Erbe
10:00 HL 10.2 Fabrication of NbC Josephson-junction arrays by focused-ion-beam-induced deposition — •Fabrizio Porrati, Felix Jungwirth, Sven Barth, and Michael Huth
10:20 HL 10.3 Avoiding amorphization during semiconductor nanostructure ion beam irradiation — •G. Hlawacek, X. Xu, W. Möller, H.-J. Engelmann, N. Klingner, A. Gharbi, K.-H. Heinig, S. Facsko, and J. von Borany
10:40 HL 10.4 Grayscale Lithography: Creating complex 2.5D structures in thick photoresist by direct laser writing — •Dominique Collé
  11:00 20 min. break
11:20 HL 10.5 Hauptvortrag: Shapeable materials technologies for high resolution patterning of 3D microelectronic devices — •Daniil Karnauschenko
11:50 HL 10.6 Coupling Single Mode Fibers to Single Quantum Emitters using Femtosecond 3D Printing Technology — •Ksenia Weber, Simon Thiele, Simon Ristok, Sarah Fischbach, Jan Hausen, Lucas Bremer, Mark Saritson, Simone Protalupi, Alois Herkommer, Stefan Reitzenstein, Peter Michler, and Harald Gießen
12:10 HL 10.7 Optical properties of photoresists for femtosecond 3D printing: Refractive index, extinction, luminescence - dose dependence, aging, heat treatment and comparison between 1-photon and 2-photon exposure — •Michael Schmid, Dominik Ludescher, and Harald Giessen
12:30 HL 10.8 Acoustic Impedance Matching on Ultrasonic Devices using Additive Manufacturing — •Severin Schweiger, Sandro Koch, Marcel Krenkel, and Marco Kircher
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