Dresden 2020 – scientific programme

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HL: Fachverband Halbleiterphysik

HL 75: Poster IIIB

HL 75.14: Poster

Thursday, March 19, 2020, 15:00–17:30, P2/3OG

Applying infrared thermography for thermal interface analysis — •Steven Becker and Manfred Bayer — TU Dortmund University, Dortmund, Germany

Combining µLEDs to array-structures enables the manufacturing of high-resolution light sources in a small form factor. Thermal interface analyses are crucial to improve these devices, but chip-level electronics limit the pixel-wise accessibility of the required junction temperature. Here we present an approach to overcome this limitation by using thermal images as data for the JEDEC 51-14 standard’s calculation. Thermal imaging cameras are promising candidates due to their spatially resolved and contactless measurement of the µLED array temperature.