Mainz 2022 – wissenschaftliches Programm

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HK: Fachverband Physik der Hadronen und Kerne

HK 4: Instrumentation I

HK 4.4: Vortrag

Montag, 28. März 2022, 15:00–15:15, HK-H3

Towards a wafer-scale, bent silicon prototype for the ALICE ITS3 — •Alperen Yuncu for the ALICE collaboration — Physikalisches Institut, Ruprecht-Karls-Universität Heidelberg, Germany

ALICE aims at replacing the three innermost layers of its Inner Tracking System (ITS2) in the LHC Long Shutdown 3. The new vertex detector (ITS3) will be based on wafer-scale, ultra-thin, cylindrical Monolithic Active Pixel Sensors (MAPS). The new sensors will have a thickness of 20−40 µm and a length of 28 cm. They will be installed around a new beam pipe and the closest layer will be at a radial distance of only 18 mm from the interaction point.

The thickness of the sensors reaches unprecedented values for wafer-scale sensors, which poses a number of R&D challenges. To advance the study of mechanical and electrical properties for large, ultra-thin sensors, before the final silicon for ITS3 will become available, “super-ALPIDE" chips are produced and characterized. These consist of a matrix of 9×2 ALPIDEs (the sensors used for ITS2) diced out from a wafer as a single piece of silicon and have a size of 13.5×6 cm, close to 1/2 the final layer 0. They were produced in three different thicknesses (30, 40, 50 µm) and are now used for mechanical and electromechanical integration tests.